The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2025

Filed:

Sep. 23, 2019
Applicant:

Medtronic Minimed, Inc., Northridge, CA (US);

Inventors:

David C. Antonio, Pasadena, CA (US);

Eric Allan Larson, Simi Valley, CA (US);

Jose J. Ruelas, San Fernando, CA (US);

Akhil Srinivasan, Sherman Oaks, CA (US);

Assignee:

Medtronic MiniMed, Inc., Northridge, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 5/00 (2006.01); A61B 5/145 (2006.01); A61B 5/1473 (2006.01); A61B 5/1486 (2006.01); A61B 5/15 (2006.01); A61M 5/158 (2006.01); A61M 5/172 (2006.01);
U.S. Cl.
CPC ...
A61B 5/6833 (2013.01); A61B 5/0002 (2013.01); A61B 5/0022 (2013.01); A61B 5/14503 (2013.01); A61B 5/14532 (2013.01); A61B 5/1486 (2013.01); A61B 5/150236 (2013.01); A61B 5/150633 (2013.01); A61B 5/150732 (2013.01); A61B 5/6832 (2013.01); A61M 5/158 (2013.01); A61M 5/1723 (2013.01); A61B 5/145 (2013.01); A61B 5/1473 (2013.01); A61B 5/14865 (2013.01); A61B 5/150022 (2013.01); A61B 5/150969 (2013.01); A61B 2560/0214 (2013.01); A61B 2560/045 (2013.01); A61B 2560/063 (2013.01); A61B 2562/04 (2013.01); A61B 2562/16 (2013.01); A61B 2562/227 (2013.01); A61M 2005/1585 (2013.01); A61M 2005/1586 (2013.01); A61M 2005/1726 (2013.01); A61M 2205/3569 (2013.01);
Abstract

This disclosure generally relates to medical devices that include a sensor transmitter assembly that includes a sensor assembly including a sensor module where a first sensor including a first sensor head having at least one first sensor contact pad is combined with a second sensor including a second sensor head having at least one second sensor contact pad. The sensor transmitter assembly also includes a transmitter assembly positioned on a top of the sensor assembly to form a single unit, the transmitter assembly having at least one transmitter contact disposed on a base of the transmitter assembly, where the first sensor contact pad(s) and the second sensor form a connection path with the transmitter contact(s).


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