The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Nov. 12, 2021
Applicants:

Hefei Boe Joint Technology Co., Ltd., Anhui, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Luke Ding, Beijing, CN;

Yongqian Li, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/131 (2023.01); G09G 3/3233 (2016.01); H10K 59/12 (2023.01); H10K 59/124 (2023.01);
U.S. Cl.
CPC ...
H10K 59/131 (2023.02); G09G 3/3233 (2013.01); H10K 59/1201 (2023.02); H10K 59/124 (2023.02); G09G 2300/0819 (2013.01); G09G 2300/0842 (2013.01); G09G 2310/08 (2013.01);
Abstract

A display substrate and a display device are provided. The display substrate includes a light emitting element disposed on a base substrate, and an encapsulation layer, a connection layer, a light extraction layer, a polarization conversion layer and a polarization layer stacked sequentially at a light exiting side of the light emitting element. The light extraction layer is configured to convert at least a portion of light emitted by the light emitting element incident onto the light extraction layer into circularly polarized light with a set rotational direction to pass through the light extraction layer. The polarization conversion layer is configured to convert the circularly polarized light passing through the light extraction layer into linearly polarized light, with a polarization direction parallel to a direction of a light transmission axis of the polarization layer; the connection layer is configured to bond the light extraction layer to the encapsulation layer.


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