The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

May. 25, 2022
Applicant:

Xiamen Sanan Optoelectronics Co., Ltd., Xiamen, CN;

Inventors:

Shiwei Liu, Xiamen, CN;

Gaolin Zheng, Xiamen, CN;

Anhe He, Xiamen, CN;

Qing Wang, Xiamen, CN;

Su-Hui Lin, Xiamen, CN;

Kang-Wei Peng, Xiamen, CN;

Ling-Yuan Hong, Xiamen, CN;

Jiangbin Zeng, Xiamen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 23/00 (2006.01); H10H 20/813 (2025.01); H10H 20/831 (2025.01); H10H 20/832 (2025.01); H10H 20/841 (2025.01); H10H 20/85 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H10H 20/813 (2025.01); H01L 24/81 (2013.01); H01L 2224/05026 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05084 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05561 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16502 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01);
Abstract

A light-emitting device includes a carrier substrate, a flip-chip light-emitting diode (LED) mounted onto the carrier substrate, and an electrode unit disposed between the carrier substrate and the flip-chip LED. The electrode unit includes first and second connecting electrodes that have opposite conductivity. Each of the first and second connecting electrodes includes an intermediate metal layer and a binding layer that are sequentially disposed on the flip-chip LED in such order. The binding layer includes a first portion being adjacent to the carrier substrate and forming an eutectic system with tin, and a second portion located between the first portion and the intermediate metal layer.


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