The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

May. 03, 2021
Applicant:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Inventors:

Se Hee Oh, Ansan-si, KR;

Hyun A Kim, Ansan-si, KR;

Jong Kyu Kim, Ansan-si, KR;

Hyoung Jin Lim, Ansan-si, KR;

Assignee:

SEOUL VIOSYS CO., LTD., Ansan-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); F21S 41/141 (2018.01); H01L 25/075 (2006.01); H10H 20/813 (2025.01); H10H 20/814 (2025.01); H10H 20/82 (2025.01); H10H 20/821 (2025.01); H10H 20/825 (2025.01); H10H 20/831 (2025.01); H10H 20/832 (2025.01); H10H 20/84 (2025.01); H10H 20/841 (2025.01); H10H 20/851 (2025.01); H10H 20/858 (2025.01); H10H 29/14 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 25/0753 (2013.01); H10H 20/814 (2025.01); H10H 20/8252 (2025.01); H10H 20/831 (2025.01); H10H 20/835 (2025.01); H10H 20/84 (2025.01); H10H 20/851 (2025.01); H10H 20/858 (2025.01); H10H 29/14 (2025.01); F21S 41/141 (2018.01); H10H 20/813 (2025.01); H10H 20/82 (2025.01); H10H 20/821 (2025.01); H10H 20/8312 (2025.01); H10H 20/841 (2025.01);
Abstract

A light emitting diode includes a first conductivity type semiconductor layer, a mesa with an active layer and a second conductivity type semiconductor layer disposed thereon, a first contact layer comprising an outer contact portion contacting the first conductivity type semiconductor layer near an edge thereof and an inner contact portion contacting the first conductivity type semiconductor layer in a region surrounded by the outer contact portion; a second contact layer disposed on the mesa and contacting the second conductivity type semiconductor layer; a first insulation layer covering the mesa, insulating the first contact layer, and exposing the first conductivity type semiconductor layer for the outer contact portion and the inner contact portion to contact the first conductivity type semiconductor layer, wherein the outer contact portion and the first insulation layer alternately contact the first conductivity type semiconductor layer along a side surface of the mesa.


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