The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Apr. 25, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sunjae Kim, Seoul, KR;

Chungho Song, Suwon-si, KR;

Yonghoe Cho, Cheonan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10F 39/00 (2025.01); H01L 23/00 (2006.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H10F 39/18 (2025.01);
U.S. Cl.
CPC ...
H10F 39/804 (2025.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H10F 39/811 (2025.01); H01L 24/26 (2013.01); H01L 24/29 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/33183 (2013.01); H01L 2224/73153 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92143 (2013.01); H01L 2224/97 (2013.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H10F 39/182 (2025.01); H10F 39/8063 (2025.01);
Abstract

An image sensor package includes: a package base substrate having a cavity extending inwards from an upper surface thereof, and including a plurality of upper surface connection pads and a plurality of lower surface connection pads; an image sensor chip in the cavity, and including a chip body having a first surface and a second surface facing each other, a sensor unit located in the first surface of the chip body, and a plurality of chip pads around the sensor unit; a filter glass above the image sensor chip, and including a transparent substrate and a plurality of redistribution patterns on a lower surface of the transparent substrate; and a plurality of connection terminals between the plurality of redistribution patterns and the plurality of chip pads and between the plurality of redistribution patterns and the plurality of upper surface connection pads.


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