The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Nov. 17, 2022
Applicant:

Auo Corporation, Hsinchu, TW;

Inventor:

Chen-Shuo Huang, Hsinchu, TW;

Assignee:

AUO Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/67 (2025.01); H01L 21/02 (2006.01); H01L 21/383 (2006.01); H01L 21/426 (2006.01); H10D 99/00 (2025.01);
U.S. Cl.
CPC ...
H10D 30/6755 (2025.01); H01L 21/02565 (2013.01); H01L 21/383 (2013.01); H01L 21/426 (2013.01); H10D 30/6734 (2025.01); H10D 30/6757 (2025.01); H10D 99/00 (2025.01);
Abstract

A semiconductor device includes a substrate, a semiconductor structure, a gate dielectric layer, a first gate, a source and a drain. The semiconductor structure is disposed above the substrate. The semiconductor structure includes a first thick portion, a second thick portion, and a thin portion between the first thick portion and the second thick portion. The gate dielectric layer is disposed on the semiconductor structure. The first gate is disposed on the gate dielectric layer. The first gate overlaps a portion of the first thick portion and a portion of the thin portion. The first gate does not overlap another portion of the thin portion and the second thick portion. The source is electrically connected to the first thick portion. The drain is electrically connected to the second thick portion.


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