The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Jul. 16, 2020
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Toshiki Fukasawa, Tokyo, JP;

Tomohito Kudo, Tokyo, JP;

Hideki Haruguchi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 8/60 (2025.01); H10D 8/01 (2025.01); H10D 30/66 (2025.01); H10D 62/10 (2025.01);
U.S. Cl.
CPC ...
H10D 8/605 (2025.01); H10D 8/051 (2025.01); H10D 30/668 (2025.01); H10D 62/106 (2025.01);
Abstract

A silicon substrate has first to fourth semiconductor regions. The third semiconductor region is separated from the first semiconductor region of a first conductivity type by the second semiconductor region of a second conductivity type. The fourth semiconductor region of the second conductivity type is separated from the second semiconductor region by the third semiconductor region. A first electrode is provided on a first surface. A barrier metal layer is provided on a first portion of a second surface. A second electrode is provided on the second surface, and is separated from the first portion of the second surface by the barrier metal layer. The second electrode includes an aluminum-silicon (Al—Si) layer in contact with a second portion of the second surface, and an Al layer separated from the second portion of the second surface by the Al—Si layer.


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