The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Aug. 04, 2022
Applicant:

Microchip Technology Incorporated, Chandler, AZ (US);

Inventor:

Yaojian Leng, Vancouver, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H10B 12/00 (2023.01); H10D 1/00 (2025.01); H10D 1/68 (2025.01);
U.S. Cl.
CPC ...
H10D 1/042 (2025.01); H01L 23/5223 (2013.01); H10B 12/038 (2023.02); H10B 12/0387 (2023.02); H10B 12/37 (2023.02); H10D 1/043 (2025.01); H10D 1/696 (2025.01); H10D 1/716 (2025.01);
Abstract

A multi-capacitor module includes a stacked metal-insulator-metal (MIM) structure including a cup-shaped first electrode, a cup-shaped first insulator formed over the cup-shaped first electrode, a cup-shaped second electrode formed over the cup-shaped first insulator, a cup-shaped second insulator formed over the cup-shaped second electrode, a third electrode formed over the cup-shaped second insulator. The stacked MIM structure also includes a first sidewall spacer located between the cup-shaped first electrode and the cup-shaped second electrode, and a second sidewall spacer located between the cup-shaped second electrode and the third electrode. The cup-shaped first electrode, the cup-shaped second electrode, and the cup-shaped first insulator define a first capacitor, and the cup-shaped second electrode, the third electrode, and the cup-shaped second insulator define a second capacitor.


Find Patent Forward Citations

Leng, Yaojian. (2025). Multi-capacitor module including a stacked metal-insulator-metal (mim) structure (U.S. Patent No. 12439614). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12439614

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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