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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12439603 B1

PDFFull Text
Date of Patent:
Oct. 07, 2025

Filed:

Mar. 09, 2022

Semiconductor device including separate upper channel structures and electronic system including the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Euntaek Jung, Hwaseong-si, KR;

Jaeho Kim, Hwaseong-si, KR;

Joonsung Kim, Seoul, KR;

Jiwon Kim, Hwaseong-si, KR;

Sukkang Sung, Seongnam-si, KR;

Sangdon Lee, Hwaseong-si, KR;

Jong-Min Lee, Yongin-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Attorney:

Wolf, Greenfield & Sacks, P.C.

Primary Examiner:

Norman D Richards

Assistant Examiner:

Laura M Dykes

Int. Cl.
CPC ...
H10B 43/35 (2023.01); G11C 16/04 (2006.01); H01L 23/528 (2006.01); H10B 41/10 (2023.01); H10B 41/27 (2023.01); H10B 41/35 (2023.01); H10B 41/40 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/40 (2023.01);
U.S. Cl.
CPC ...
H10B 43/35 (2023.02); G11C 16/0483 (2013.01); H01L 23/5283 (2013.01); H10B 41/10 (2023.02); H10B 41/27 (2023.02); H10B 41/35 (2023.02); H10B 41/40 (2023.02); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/40 (2023.02);
Abstract

A semiconductor device includes an electrode structure including electrodes stacked on a substrate and an insulating pattern on an uppermost electrode of the electrodes, a vertical structure that penetrates the electrode structure and is connected to the substrate, a first insulating layer on the electrode and the vertical structure, a conductive pattern that penetrates the first insulating layer and is connected to the vertical structure, an upper horizontal electrode on the conductive pattern, and an upper semiconductor pattern that penetrates the upper horizontal electrode and is connected to the conductive pattern. The conductive pattern has a first side surface on the vertical structure and a second side surface on the insulating pattern.

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