The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Jul. 31, 2023
Applicant:

Hewlett Packard Enterprise Development Lp, Spring, TX (US);

Inventors:

Harvey J. Lunsman, Chippewa Falls, WI (US);

Michael Scott, Chippewa Falls, WI (US);

Steven Dean, Chippewa Falls, WI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/40 (2006.01); G02B 6/42 (2006.01); H04B 1/036 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2049 (2013.01); H05K 7/20254 (2013.01); G02B 6/4268 (2013.01); H01L 23/40 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01); H04B 1/036 (2013.01);
Abstract

Cooling module includes a mounting element, a force application member, a lever, and a cold plate movably coupled to the mounting element. The mounting element having engagement members, is coupled to a receptacle of an electronic device that is configured to receive a removable electronic device at the receptacle. The force application member having spring fingers, is disposed between the mounting element and the cold plate, and movable relative to the mounting element. The lever is connected to the mounting element and the force application member and shiftable between actuated and unactuated states. In the actuated state, the lever pushes the force application member along a first direction causing the engagement members to move the force application member along a second direction perpendicular to the first direction and urge the cold plate to compress the spring fingers and establish thermal contact between the cold plate and the removable electronic module.


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