The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Nov. 25, 2022
Transparent member, electronic device including same, and thermoforming method of transparent member
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Hosoon Lee, Gyeonggi-do, KR;
Juree Kim, Gyeonggi-do, KR;
Sangung An, Gyeonggi-do, KR;
Junseok Kim, Gyeonggi-do, KR;
Jongcheol Jang, Gyeonggi-do, KR;
Hyunsuk Choi, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A method of forming a transparent member according to an embodiment may include: a process of putting a first transparent substrate and a second transparent substrate into a first cavity of a lower mold that has a first depth and a second cavity of a lower mold that is connected to the first cavity and has a second depth, respectively; a process of disposing an upper mold, which corresponds to the lower mold and includes a pressing portion having at least one pressing surface, on an upper portion of the lower mold; a process of preheating at least one of the lower mold in which the transparent substrates are disposed or the upper mold to a predetermined temperature; and a process of thermoforming the preheated transparent substrates by pressing the preheated transparent substrates in a manner of pressing the upper mold. Various other embodiments identified through the specification are possible.