The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Jun. 02, 2023
Applicant:
Asustek Computer Inc., Taipei, TW;
Inventors:
Assignee:
ASUSTEK COMPUTER INC., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); B32B 3/26 (2006.01); B32B 5/18 (2006.01); B32B 7/14 (2006.01); B32B 27/06 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0211 (2022.08); B32B 3/266 (2013.01); B32B 5/18 (2013.01); B32B 7/14 (2013.01); B32B 27/065 (2013.01); B32B 2307/304 (2013.01); B32B 2307/7376 (2023.05); B32B 2457/00 (2013.01);
Abstract
A heat insulation pad applied to an electronic device is provided. The electronic device includes a housing and a heat source. The housing includes an inner side surface. The heat insulation pad includes a first contact layer, a second contact layer, and a hole layer stack structure. The first contact layer is adapted to attach to the inner side surface. The second contact layer is adapted to contact the heat source. The hole layer stack structure includes a plurality of hole layers stacked in sequence and is located between the first contact layer and the second contact layer. An electronic device with the heat insulation pad is further provided.