The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
May. 17, 2023
Applicant:
Additive Technologies Llc, Palm City, FL (US);
Inventors:
Denis Cormier, Pittsford, NY (US);
Santokh S. Badesha, Pittsford, NY (US);
Varun Sambhy, Pittsford, NY (US);
Assignee:
Additive Technologies LLC, Palm City, FL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); H05K 3/40 (2006.01); H05K 13/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/125 (2013.01); H05K 3/4046 (2013.01); H05K 3/4053 (2013.01); H05K 13/0092 (2013.01); H05K 2203/128 (2013.01);
Abstract
A method for operating a three-dimensional (3D) metal object manufacturing apparatus selects operational parameters for operation of the printer to form vias in substrates. The method identifies the bulk metal being melted for ejection and uses this identification data to select the operational parameters. The method identifies the via holes in the substrate and operates an actuator to position an ejector opposite the via holes to eject drops of melted bulk metal toward the via holes to fill the via holes.