The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Dec. 02, 2022
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventors:

Jae Hoon Ko, Gyeonggi-do, KR;

Jeffrey E. Kwak, Gyeonggi-do, KR;

In Myung Song, Gyeonggi-do, KR;

Chong Geun Ahn, Gyeonggi-do, KR;

Assignee:

SK hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0219 (2013.01); H05K 1/0237 (2013.01); H05K 1/0313 (2013.01);
Abstract

The present disclosure relates to an electronic circuit. A circuit board according to the present disclosure includes a first conductor layer including a first pad for transmitting and receiving a first signal to and from an external device, a plurality of second conductor layers stacked on the first conductor layer, and a third conductor layer stacked on the plurality of second conductor layers and including a second pad for transmitting and receiving a second signal to and from the external device, wherein at least one target conductor layer among the plurality of second conductor layers has a mesh structure and is electrically grounded, and remaining second conductor layers except for the at least one target conductor layer include respective voids and are electrically opened.


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