The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Apr. 22, 2020
Applicant:

Harman International Industries, Incorporated, Stamford, CT (US);

Inventor:

Yu Du, Novi, MI (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 1/04 (2006.01); B81B 3/00 (2006.01); H04R 1/08 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); B81B 3/0021 (2013.01); H04R 1/083 (2013.01); H05K 1/181 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01);
Abstract

In at least one embodiment, a microphone assembly including an enclosure, a first printed circuit board (PCB) and a microphone assembly is provided. The microphone assembly includes a sub-casing, a micro-electro-mechanical systems (MEMS) transducer, and a second PCB. The MEMS transducer positioned in the sub-casing and the second PCB supports the MEMS transducer. The first PCB defines a first acoustic path positioned below the second PCB and the MEMS transducer. The second PCB defines a first audio port positioned directly below the MEMS transducer. The enclosure defines a first acoustic opening that is positioned directly below the first acoustic path to enable an audio input signal to pass through the first audio port and to an underside of the MEMS transducer. The enclosure defines a second acoustic opening that is positioned at a distance of between 3 to 30 mm from the first acoustic opening.


Find Patent Forward Citations

Du, Yu. (2025). Micro-electro-mechanical systems (mems) microphone assembly (U.S. Patent No. 12439188). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12439188

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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