The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Dec. 08, 2021
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Pengfei Wu, Shanghai, CN;

Hanyang Wang, Reading, GB;

Meng Hou, Shanghai, CN;

Chien-Ming Lee, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 1/48 (2006.01); H01Q 1/50 (2006.01); H01Q 1/52 (2006.01); H01Q 13/18 (2006.01); H01Q 21/28 (2006.01); H01Q 5/378 (2015.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01); H01Q 1/50 (2013.01); H01Q 1/523 (2013.01); H01Q 13/18 (2013.01); H01Q 21/28 (2013.01); H01Q 5/378 (2015.01);
Abstract

An electronic device includes a conductive frame and a first antenna unit. The conductive frame is disposed around a periphery of the electronic device. The first antenna unit includes a first conductive layer and a second conductive layer spaced apart in a thickness direction of the electronic device; a conductive connection portion is configured to connect the first conductive layer and the second conductive layer; and a first conductive frame, is a part of the conductive frame. The conductive connection portion, the first conductive frame, the first conductive layer, and the second conductive layer enclose a first cavity, and the first conductive layer and the first conductive frame are spaced apart to form a first slot of the first cavity.


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