The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Apr. 18, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Joonsung Kim, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a connection substrate on a package substrate and has an opening that penetrates therethrough. A chip stack is on the package substrate and in the opening. A redistribution layer is on the connection substrate and the chip stack. An upper semiconductor chip is on first redistribution pads of the redistribution layer. External terminals are on a bottom surface of the package substrate. The chip stack includes a first semiconductor chip on substrate pads of the package substrate, and a second semiconductor chip on the first semiconductor chip and second redistribution pads of the redistribution layer. The redistribution layer includes a first region that overlaps the upper semiconductor chip and a second region beside the upper semiconductor chip. The first redistribution pads are on the first region. The second redistribution pads are on the second region.