The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Mar. 18, 2022
Applicant:
Meta Platforms, Inc., Menlo Park, CA (US);
Inventors:
Sandeep Rekhi, San Jose, CA (US);
Pradip Sairam Pichumani, Bellevue, WA (US);
Assignee:
Meta Platforms, Inc., Menlo Park, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01L 24/40 (2013.01); H01L 23/552 (2013.01); H01L 24/77 (2013.01); H01L 24/84 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/77343 (2013.01); H01L 2224/7755 (2013.01); H01L 2224/84047 (2013.01); H01L 2224/8412 (2013.01); H01L 2224/84207 (2013.01); H01L 2924/3025 (2013.01);
Abstract
Embodiments relate to an integrated circuit package having an integrated circuit die connected to a package substrate through conductors of a flex cable. The flex cable includes an insulating housing made of an insulating material and a plurality of conductors disposed inside the insulating housing. Each conductor of the plurality of conductors is connected to a first contact of a plurality of contacts of the integrated circuit die and a second contact of a plurality of contacts of the package substrate.