The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Dec. 13, 2021
International Business Machines Corporation, Armonk, NY (US);
Hsueh-Chung Chen, Cohoes, NY (US);
Yann Mignot, Slingerlands, NY (US);
Chi-Chun Liu, Altamont, NY (US);
Mary Claire Silvestre, Clifton Park, NY (US);
Jennifer Oakley, Cohoes, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
A semiconductor device includes a conductive line disposed within a dielectric layer, a metal layer disposed over and in direct contact with the conductive line, and a metallization layer disposed over the metal layer such that a protruding segment of the metal layer acts as an interface between the conductive line and the metallization layer. The conductive line is copper (Cu) and the metal layer is ruthenium (Ru). The Ru metal layer includes an upper metal layer section and a lower metal layer section.