The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Feb. 15, 2023
Applicant:
Canon Anelva Corporation, Kanagawa, JP;
Inventors:
Assignee:
CANON ANELVA CORPORATION, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); C23C 14/20 (2006.01); C23C 14/34 (2006.01); C23C 14/58 (2006.01); C23C 28/00 (2006.01); C25D 7/12 (2006.01); H01J 37/305 (2006.01); H01J 37/317 (2006.01); H01J 37/32 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49894 (2013.01); C23C 14/205 (2013.01); C23C 14/3464 (2013.01); C23C 14/5833 (2013.01); C23C 14/5846 (2013.01); C23C 28/32 (2013.01); C23C 28/341 (2013.01); C25D 7/123 (2013.01); H01J 37/3053 (2013.01); H01J 37/3178 (2013.01); H01J 37/32082 (2013.01); H01L 21/4846 (2013.01); H01L 23/49838 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01);
Abstract
Provided are a laminated body and a laminated body manufacturing method that can improve adhesiveness between a resin layer and a seed layer. The laminated body has a substrate, a first wiring layer, a resin layer, and a second wiring layer in this order, and the second wiring layer includes at least an adhesive layer and a seed layer in this order.