The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

May. 09, 2022
Applicant:

Nanya Technology Corporation, New Taipei, TW;

Inventor:

Wu-Der Yang, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05578 (2013.01); H01L 2224/06132 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/4917 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49177 (2013.01); H01L 2224/73215 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/182 (2013.01);
Abstract

A WBGA package and a method of manufacturing a WBGA package are provided. The WBGA package includes a carrier having a first surface and a second surface opposite to the first surface of the carrier. The carrier has a through hole filled with a first package body and extending between the first surface and the second surface of the carrier. The WBGA package also includes an electronic component disposed on the second surface of the carrier. The electronic component includes a first bonding pad and a second bonding pad. The WBGA package also includes a first bonding wire electrically connected between the first bonding pad and the second bonding pad.


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