The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Jul. 30, 2021
Applicant:
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Inventors:
Mayank Mayukh, Fort Collins, CO (US);
Shrikara Prabhu Tendel, Singapore, SG;
Sam Karikalan, Irvine, CA (US);
Nicole A Butel, Fort Collins, CO (US);
Assignee:
Avago Technologies International Sales Pte. Limited, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); C09K 5/10 (2006.01); C09K 5/14 (2006.01); H01L 21/52 (2006.01); H01L 23/373 (2006.01); H01L 23/52 (2006.01); H01L 23/367 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/3737 (2013.01); C09K 5/10 (2013.01); C09K 5/14 (2013.01); H01L 21/52 (2013.01); H01L 23/3733 (2013.01); H01L 23/3675 (2013.01); H01L 25/0655 (2013.01); H01L 25/18 (2013.01);
Abstract
An integrated circuit (IC) package includes a one or more die, a package substrate, a thermal interface material, and a cover. The cover is disposed over or above the one or more die. The thermal interface material includes a surface modified metal and a silicon monomer.