The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Jan. 24, 2023
Applicant:

Rolls-royce Deutschland Ltd & CO KG, Blankenfelde-Mahlow, DE;

Inventors:

Uwe Waltrich, Forchheim, DE;

Stanley Buchert, Herzogenaurach, DE;

Marco Bohlländer, Hirschaid, DE;

Claus Müller, Wolfratshausen, DE;

Assignee:

Rolls-Royce Deutschland Ltd & Co KG, Blankenfelde-Mahlow, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); B60L 50/00 (2019.01); B64D 27/34 (2024.01); B64D 27/35 (2024.01); B64D 27/359 (2024.01); H01L 23/48 (2006.01); H02M 1/00 (2006.01); H02M 1/08 (2006.01); H02M 7/00 (2006.01); H02M 7/219 (2006.01); H02P 27/06 (2006.01); H03K 17/56 (2006.01); H05K 1/14 (2006.01); B64D 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); B60L 50/00 (2019.02); B64D 27/34 (2024.01); B64D 27/35 (2024.01); B64D 27/359 (2024.01); H01L 23/48 (2013.01); H02M 1/0054 (2021.05); H02M 1/08 (2013.01); H02M 7/003 (2013.01); H02M 7/219 (2013.01); H02P 27/06 (2013.01); H03K 17/56 (2013.01); H05K 1/144 (2013.01); B60L 2200/10 (2013.01); B60L 2210/30 (2013.01); B64D 27/026 (2024.01);
Abstract

A method of designing and manufacturing a power electronics converter for an electrical power system is provided. A circuit design for the power electronics converter is selected. A shape constraint for integrating the power electronics converter into the electrical power system is determined, and at least one multi-layer carrier substrate is obtained according to the determined shape constraint. A plurality of power semiconductor prepackages are obtained. Each power semiconductor prepackage includes a power semiconductor switching element embedded in a solid insulating material and an electrical connection extending through the solid insulating material from a terminal of the power semiconductor switching element to a connection surface of the prepackage. The power electronics converter is assembled by forming electrically conductive connections in a z-direction connecting terminals of the power semiconductor switching elements of the power semiconductor prepackages and one or more electrically conductive layers of the multi-layer carrier substrate.


Find Patent Forward Citations

Loading…