The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Jun. 07, 2022
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventor:

Harutoshi Tsuji, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/047 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 23/047 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/16 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1715 (2013.01);
Abstract

A semiconductor device includes: a conductive base substrate; a semiconductor chip mounted on the base substrate and having a signal pad; a frame configured to surround the semiconductor chip, to be mounted on the base substrate, and to include a step having an inner first upper surface and an outer second upper surface higher than the first upper surface in a plan view, wherein a first conductor pattern provided on the first upper surface is electrically connected to the base substrate; a capacitive component mounted on the first conductor pattern; a signal terminal mounted on the second upper surface of the frame; a first bonding wire configured to electrically connect the signal pad and an upper surface of the capacitive component; and a second bonding wire configured to electrically connect the upper surface of the capacitive component and the signal terminal.


Find Patent Forward Citations

Tsuji, Harutoshi. (2025). Semiconductor device and package (U.S. Patent No. 12438057). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12438057

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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