The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Oct. 28, 2020
Applicant:

Yamaha Robotics Holdings Co., Ltd., Tokyo, JP;

Inventors:

Michael Kirkby, Tokyo, JP;

Hiroshi Munakata, Tokyo, JP;

Takuya Adachi, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/84 (2006.01); B06B 1/02 (2006.01); G01N 21/88 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); B06B 1/0284 (2013.01); G01N 21/8806 (2013.01); G01N 21/8851 (2013.01); G01N 2021/8864 (2013.01); G01N 2021/8896 (2013.01);
Abstract

An ultrasound vibrating-type defect detection apparatus () for detecting a defect in a semiconductor apparatus () is provided with: an ultrasound vibrator (); a high-frequency power supply (); a camera (); and a controller () for adjusting the frequency of high-frequency power supplied from the high-frequency power supply () to the ultrasound vibrator (), and for performing detection of a defect in the semiconductor apparatus (). The controller () causes the camera () to capture an image of the semiconductor apparatus () while varying the frequency of high-frequency power supplied from the high-frequency power supply () to the ultrasound vibrator (), and performs detection of a defect in the semiconductor apparatus () on the basis of the captured image.


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