The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Sep. 29, 2021
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Guangcai Yuan, Beijing, CN;

Haixu Li, Beijing, CN;

Xin Gu, Beijing, CN;

Jing Feng, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B65G 43/10 (2006.01); H01L 25/075 (2006.01); H10H 20/857 (2025.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H10H 20/857 (2025.01); B65G 43/10 (2013.01); H01L 2221/68309 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01);
Abstract

The disclosure provides an apparatus for transferring LED chips, including: first light source configured to generate and emit first light rays; first support structure configured to carry load substrate, load substrate including light-transmissive substrate and the LED chips fixed on side of the light-transmissive substrate away from first light source by dissociation adhesive; second support structure configured to carry to-be-transferred substrate on side of the LED chips away from light-transmissive substrate; and optical control mechanism on side of light-transmissive substrate away from the LED chips and configured to control propagation direction of first light rays that irradiate onto first radiation region of the optical control mechanism to form target light rays that irradiate onto target radiation region of load substrate, so that dissociation adhesive in target radiation region is dissociated to transfer LED chips in target radiation region to to-be-transferred substrate.


Find Patent Forward Citations

Loading…