The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Jul. 07, 2023
Abb Schweiz Ag, Baden, CH;
Mario Hoernicke, Landau, DE;
Katharina Stark, Weinheim, DE;
ABB Schweiz AG, Baden, CH;
Abstract
A method for non-MTP module integration includes receiving by a wrapper unit logic signals, bus signals and material signals from a non-MTP module, wherein the non-MTP module is a physical module of a process plant, wherein the logic signals comprise information of logic connections and/or functions of the non-MTP module, wherein the bus signals comprise information of outputs of a fieldbus of the non-MTP module, wherein the material signals comprise information of material connections of the non-MTP module; converting, by the wrapper unit, the bus signals to open platform communication identifier architecture, OPC UA, nodes; determining, by the wrapper unit an MTP interface using the logic signals and the material signals; and determining, by the wrapper unit, a MTP conform digital black box module, using OPC UA nodes and the MTP interface.