The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Apr. 18, 2024
Applicants:

Hefei Boe Ruisheng Technology Co., Ltd., Anhui, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Jie Wang, Beijing, CN;

Xintao Wu, Beijing, CN;

Wenzhuo Tang, Beijing, CN;

Zouming Xu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01); G02F 1/13357 (2006.01); G09G 3/20 (2006.01); G09G 3/32 (2016.01); G09G 3/34 (2006.01); H10H 20/857 (2025.01); H10K 59/129 (2023.01); G02F 1/1362 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133612 (2021.01); G02F 1/133603 (2013.01); G02F 1/136204 (2013.01); G09G 3/2085 (2013.01); G09G 3/2088 (2013.01); G09G 3/32 (2013.01); G09G 3/3426 (2013.01); G09G 2300/0408 (2013.01); G09G 2300/0426 (2013.01); G09G 2300/0465 (2013.01); G09G 2310/0275 (2013.01); H05K 2201/10106 (2013.01); H10H 20/857 (2025.01); H10K 59/129 (2023.02);
Abstract

A light-emitting substrate having a functional area and a bonding area spaced apart in a first direction; the light-emitting substrate includes: a substrate, a plurality of driver chips located on the substrate and located in the functional area, and a plurality of conductive patterns located between the substrate and the plurality of driver chips. The plurality of driver chips include a plurality of first driver chips and a plurality of second driver chips; among the plurality of first driver chips, at least one first driver chip is located on at least one side of the plurality of second driver chips in the first direction. The first driver chip includes at least one dummy pin. A conductive pattern is electrically connected to a dummy pin.


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