The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Apr. 07, 2023
Applicant:

Mark J. Maynard, Easthampton, MA (US);

Inventor:

Mark J. Maynard, Easthampton, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 7/00 (2006.01); F25B 39/00 (2006.01); F25B 41/22 (2021.01); F25B 49/02 (2006.01);
U.S. Cl.
CPC ...
F25B 7/00 (2013.01); F25B 39/00 (2013.01); F25B 41/22 (2021.01); F25B 49/02 (2013.01); F25B 2500/18 (2013.01); F25B 2600/2515 (2013.01); F25B 2700/1352 (2013.01);
Abstract

A system utilizing cascading heat pump circuits (HPCs) is employed to efficiently transfer heat from low temperature reservoirs to high temperature reservoirs. The system of cascading (e.g., multistage) HPCs include at least two HPCs that are in thermal communication. The first HPC uses a first refrigerant and is configured to raise a first cold operating temperature to a first hot operating temperature. The second HPC uses a second refrigerant and is configured to raise a second cold operating temperature to a second hot operating temperature. The second HPC is in thermal communication with the first HPC through a thermal exchange block, which allows the transfer of heat between the HPCs and causes the first hot temperature to be equilibrated with the second cold temperature. The cascading HPC system also includes a system controller that is configured to optimize the coefficient of performance (COP) of the cascading HPC system.


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