The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Mar. 22, 2023
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Takahiro Miyakura, Toyama, JP;

Atsushi Moriya, Toyama, JP;

Yasuhiro Megawa, Toyama, JP;

Yasunobu Koshi, Toyama, JP;

Akito Hirano, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 1/02 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C30B 1/026 (2013.01); C30B 1/023 (2013.01); H01L 21/02524 (2013.01);
Abstract

There is provided a technique that includes: (a) forming a first film containing a Group 14 element on a substrate at a film-forming temperature; (b) performing a crystal growth of the first film by performing a heat treatment to the first film at a first temperature; and (c) moving the Group 14 element contained in at least part of the first film toward the substrate to crystallize the first film by performing the heat treatment to the first film at a second temperature higher than the first temperature.


Find Patent Forward Citations

Miyakura, Takahiro. (2025). Substrate processing method, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus (U.S. Patent No. 12435439). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12435439

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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