The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Dec. 01, 2020
Applicant:

Posco, Pohang-si, KR;

Inventors:

Sung-Joo Kim, Gwangyang-si, KR;

Heung-Yun Kim, Pohang-si, KR;

Myung-Soo Kim, Gwangyang-si, KR;

Dae-Young Kang, Gwangyang-si, KR;

Yong-Joo Kim, Gwangyang-si, KR;

Assignee:

POSCO, Pohang-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 2/14 (2006.01); B32B 15/01 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); C22C 18/00 (2006.01); C22C 18/04 (2006.01); C23C 2/00 (2006.01); C23C 2/06 (2006.01); C23C 2/20 (2006.01); C23C 2/26 (2006.01); C23C 2/28 (2006.01); C23C 2/40 (2006.01); C23C 28/00 (2006.01); C23C 28/02 (2006.01); C23C 30/00 (2006.01);
U.S. Cl.
CPC ...
C23C 2/522 (2022.08); B32B 15/01 (2013.01); B32B 15/013 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C22C 18/00 (2013.01); C22C 18/04 (2013.01); C23C 2/06 (2013.01); C23C 2/14 (2013.01); C23C 2/20 (2013.01); C23C 2/26 (2013.01); C23C 2/261 (2022.08); C23C 2/28 (2013.01); C23C 2/285 (2013.01); C23C 2/40 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 28/025 (2013.01); C23C 28/3225 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); Y10T 428/12757 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12951 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/265 (2015.01); Y10T 428/27 (2015.01);
Abstract

A hot-dipped galvanized steel sheet of the present invention includes: a base steel sheet; a Zn—Mg—Al based plating layer provided on at least one surface of the base steel sheet and including, in wt %, with respect to components other than iron (Fe) diffused from the base steel sheet, 5.1 to 25% of Al and 4.0-10% of Mg, and the remainder of Zn and other inevitable impurities; and an interfacial alloy layer having a Fe—Al—Zn composition formed between the base steel sheet and the plating layer, wherein the interfacial alloy layer has a thickness of 0.5-2 μm and has a dendritic form, the Zn—Mg—Al based plating layer has a Zn—Al—MgZnternary eutectic structure, a Zn—MgZnbinary eutectic structure, and a structure including one or more of an Al single-phase structure having solid-solubilized Zn and a Zn single-phase structure, and agglomerated Al is included in a MgZnstructure.


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