The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Nov. 17, 2021
Applicant:
Nitta Dupont Incorporated, Osaka, JP;
Inventor:
Noriaki Sugita, Kyoto, JP;
Assignee:
NITTA DUPONT INCORPORATED, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); B24B 37/04 (2012.01); C09K 3/14 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); B24B 37/044 (2013.01); C09K 3/14 (2013.01); H01L 21/30625 (2013.01);
Abstract
A polishing composition is provided that can reduce micro-defects on a semiconductor wafer after polishing. A polishing composition includes: an abrasive; a basic compound; a wetting agent; and a non-ionic surfactant, where the surface tension Yis not higher than 64 mN/m, and the ratio of the surface tension after dilution with water by a factor of 20, Y, to the surface tension Y, denoted by Y/Y, is not lower than 1.10 and not higher than 1.40. Here, the surface tensions Yand Yare measurements at 25° C.