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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12435206 B1

PDFFull Text
Date of Patent:
Oct. 07, 2025

Filed:

Mar. 18, 2022

Resin composition, adhesive member, and display device including the same

Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Shintaro Nagayama, Yokohama, JP;

Hideo Umeda, Yokohama, JP;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;

Attorney:
Primary Examiner:

Jessica Whiteley

Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08F 220/68 (2006.01); C08G 61/04 (2006.01); C08K 5/378 (2006.01); C08K 5/52 (2006.01); C08K 5/526 (2006.01); C09J 4/00 (2006.01); C09J 11/06 (2006.01); C09J 133/14 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01); H10K 50/844 (2023.01); H10K 50/86 (2023.01); H10K 59/40 (2023.01); H10K 77/10 (2023.01); H10K 59/80 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
C08K 5/526 (2013.01); C08F 220/68 (2013.01); C08K 5/378 (2013.01); C08K 5/52 (2013.01); C09J 4/00 (2013.01); C09J 11/06 (2013.01); C09J 133/14 (2013.01); G06F 3/0412 (2013.01); G06F 3/044 (2013.01); H10K 50/844 (2023.02); H10K 50/86 (2023.02); H10K 59/40 (2023.02); H10K 77/111 (2023.02); H10K 59/873 (2023.02); H10K 2102/311 (2023.02);
Abstract

A resin composition includes a (meth)acrylate oligomer, and an oxygen inhibition preventing agent including at least one of a phosphite compound having a boiling point of about 150° C. or higher, and a phosphine compound having a boiling point of about 150° C. or higher, wherein the oxygen inhibition preventing agent is included in an amount of about 0.1 wt % or more and less than about 1 wt % with respect to a total amount of a (meth)acrylate. An adhesive member formed by photocuring the resin composition exhibits excellent adhesion at high temperatures, and may thus exhibit excellent reliability in case used in a flexible display device.

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