The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Dec. 08, 2022
Applicant:
Agc Inc., Tokyo, JP;
Inventors:
Yu Hanawa, Tokyo, JP;
Shuhei Ogawa, Tokyo, JP;
Seiji Inaba, Tokyo, JP;
Hiroyuki Yamamoto, Tokyo, JP;
Assignee:
AGC Inc., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 17/06 (2006.01); B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 17/10 (2006.01); B32B 18/00 (2006.01); B32B 37/12 (2006.01); B32B 37/20 (2006.01); C04B 35/565 (2006.01);
U.S. Cl.
CPC ...
B32B 17/06 (2013.01); B32B 7/12 (2013.01); B32B 18/00 (2013.01); B32B 37/12 (2013.01); B32B 37/20 (2013.01); B32B 2250/03 (2013.01); B32B 2307/302 (2013.01); B32B 2307/308 (2013.01); B32B 2307/412 (2013.01); B32B 2315/02 (2013.01); B32B 2315/08 (2013.01);
Abstract
The present invention relates to a laminated member including: a glass member having a linear transmittance at a wavelength of 850 nm of 80% or more; a bonding layer including a resin and lying on the glass member; and a Si—SiC member lying on the bonding member, in which the Si—SiC member has an average linear expansion coefficient α at from 20° C. to 200° C. of from 2.85 ppm/° C. to 4.00 ppm/° C.