The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Dec. 12, 2022
Lg Energy Solution, Ltd., Seoul, KR;
Chung Hee Lee, Daejeon, KR;
Beom Su Kim, Daejeon, KR;
Yong Nam Kim, Daejeon, KR;
Dong Hyeuk Park, Daejeon, KR;
LG Energy Solution, Ltd., Seoul, KR;
Abstract
A pouch molding apparatus and method involves deforming a pouch so that a larger amount of clearance is secured to increase the capacity of the pouch, thereby improving the pouch molding process to increase the depth and capacity of a pouch cup part. The pouch molding apparatus includes a die and a punch. The die has a die groove recessed therein in a shape configured to mold a pouch. The punch is disposed above the die groove, wherein the punch includes a body part configured to be inserted into the die groove together with a pouch film disposed between the die and the punch, and pressing parts are provided on opposite sides of the body part to press the pouch film toward an inner surface of the die groove.