The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

May. 21, 2025
Applicant:

Bciflex Medical Technology Co., Ltd., Beijing, CN;

Inventors:

Kaihan Wei, Beijing, CN;

Rongfeng Zhang, Beijing, CN;

Wenbo Gu, Beijing, CN;

Qi Song, Beijing, CN;

Guiqiang Yang, Beijing, CN;

Huihui Tian, Beijing, CN;

Xiudong Lu, Beijing, CN;

Chengli Li, Beijing, CN;

Bo Zeng, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/00 (2006.01); A61N 1/05 (2006.01); A61N 1/372 (2006.01); A61N 1/375 (2006.01); A61N 1/378 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); A61N 1/0551 (2013.01); A61N 1/37229 (2013.01); A61N 1/3787 (2013.01);
Abstract

A nerve stimulator. The nerve stimulator includes: a mid-shell, a stimulation acquisition module mounted within the mid-shell, a feed-through component being disposed on an end surface of the mid-shell and being electrically connected to the stimulation acquisition module, a mounting cover being mounted on the end surface of the mid-shell and covering an outer side of the feed-through component, and a flexible electrode being connected to one side of the feed-through component toward the mounting cover and extending from the end surface to an side surface of the mid-shell. The nerve stimulator of the embodiment of the present disclosure adopts a miniature installation design, which effectively reduces damage to tissues and facilitates the expansion of the number of electrode channels. In addition, the overall sealing property of the device is significantly improved by the multi-layer sealing structure.


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