The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Jun. 16, 2020
Applicant:

Dowa Electronics Materials Co., Ltd., Tokyo, JP;

Inventors:

Yoshitaka Kadowaki, Akita, JP;

Osamu Tanaka, Akita, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/01 (2025.01); H10H 20/812 (2025.01); H10H 20/824 (2025.01);
U.S. Cl.
CPC ...
H10H 20/013 (2025.01); H10H 20/018 (2025.01); H10H 20/812 (2025.01); H10H 20/824 (2025.01);
Abstract

Provided is a method of producing a semiconductor optical device that makes it possible to improve the optical device properties of the semiconductor optical device including semiconductor layers containing at least In, As, and Sb. The method has a first step of forming an etching stop layer on an InAs growth substrate; a second step of forming a semiconductor laminate; a third step of forming a distribution portion; a fourth step of bonding the semiconductor laminate and the distribution portion to a support substrate with a metal bonding layer therebetween; and a fifth step of removing the InAs growth substrate.


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