The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Jun. 14, 2022
Applicant:
Innolux Corporation, Miao-Li County, TW;
Inventors:
Yu-Tsung Liu, Miao-Li County, TW;
Te-Yu Lee, Miao-Li County, TW;
Assignee:
INNOLUX CORPORATION, Miao-Li County, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10F 39/12 (2025.01); G06F 3/042 (2006.01); G06V 40/13 (2022.01); H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H10F 39/198 (2025.01); H10F 39/024 (2025.01); H10F 39/8057 (2025.01); H10F 39/8063 (2025.01); G06F 3/0421 (2013.01); G06V 40/1318 (2022.01);
Abstract
A method of manufacturing a sensing device includes: providing a substrate; forming a circuit element on the substrate; forming a sensing element on the substrate; forming a planarization layer on the sensing element and the circuit element; forming a first opening in the planarization layer, wherein the first opening overlaps with the circuit element; and forming a second opening in the planarization layer, wherein the second opening overlaps with the sensing element. In addition, the first opening and the second opening are formed by different processes.