The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Sep. 18, 2023
Applicant:

Mektec Corporation, Tokyo, JP;

Inventor:

Azumi Tominaga, Tokyo, JP;

Assignee:

MEKTEC CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/182 (2013.01); H05K 1/0313 (2013.01); H05K 3/0044 (2013.01); H05K 3/28 (2013.01); H05K 3/305 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/0756 (2013.01);
Abstract

Provided is a component mount board which includes: a board having a base, a first conductive pattern, a mount component connected to the first conductive pattern, and a soluble layer; and a second conductive pattern, in which the soluble layer is soluble in liquid, and the second conductive pattern is soluble in liquid or is weakened when getting wet with liquid, the base has, in a portion of the base corresponding to the second conductive pattern, a first missing portion the first conductive pattern has a first portion and a second portion separated from the first portion through the first missing portion, the second conductive pattern connects, over the first missing portion, the first and second portions of the first conductive pattern to each other, and a portion of the second conductive pattern at least over the first missing portion is formed on a first surface of the soluble layer.


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