Event-driven integrated circuit having interface system

Abstract

The present disclosure relates to an event-driven integrated circuit that includes a sensor, an interface system, and a processor. The interface module includes a copy module, a merge module, a sub-sampling module, an ROI module, and an event routing module. The modules constitute a programmable daisy chain. The sensor, interface system and processor are coupled to a single chip through an interposer or manufactured in a same die by different manufacturing processes. In contrast to prior art, the event-driven integrated circuit with lower chip occupied area and manufacturing cost can eliminate the signal loss and noise interference, and achieve high-speed signal processing, solving the technical problems of larger chip area and weak signal processing ability. The interface system enriches the functions and configurability of the interface system, and provides various advantages in power consumption, function, and speed for subsequent processing.