The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Feb. 13, 2023
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Takanori Uejima, Kyoto, JP;

Hiromichi Kitajima, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/40 (2015.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H04B 1/40 (2013.01); H05K 1/0243 (2013.01); H05K 1/115 (2013.01);
Abstract

A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; and a metal shield plate disposed over the major face and set to a ground potential. The metal shield plate includes a shield part extending in a direction perpendicular to the major face, and a joint part parallel to the major face and spaced apart from the major face, the joint part extending from the shield part. A top face of at least one of the first circuit component and the second circuit component is connected with the joint part by a bonding wire. With the module substrate seen in plan view, the metal shield plate is disposed between the first circuit component and the second circuit component.


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