The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Nov. 29, 2023
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Toshiki Tabei, Nagaokakyo, JP;
Junpei Yasuda, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/72 (2006.01);
U.S. Cl.
CPC ...
H03H 9/059 (2013.01); H03H 9/0576 (2013.01); H03H 9/1085 (2013.01); H03H 9/725 (2013.01);
Abstract
An acoustic wave device includes a first acoustic wave chip and a second acoustic wave chip mounted on a substrate, first bumps bonding the first acoustic wave chip to the substrate and including first ground bumps connected to a ground potential, second bumps bonding the second acoustic wave chip to the substrate and including second ground bumps connected to a ground potential. When a number of the first ground bumps is n1, a number of the second ground bumps is n2, a height of the first ground bumps is h1, and a height of the second ground bumps is h2, n1<n2 and h1<h2.