The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

May. 09, 2022
Applicant:

Lextar Electronics Corporation, Hsinchu, TW;

Inventors:

Fu-Hsin Chen, Hsinchu, TW;

Yu-Chun Lee, Hsinchu, TW;

Cheng-Ta Kuo, Hsinchu, TW;

Jian-Chin Liang, Hsinchu, TW;

Tzong-Liang Tsai, Hsinchu, TW;

Shiou-Yi Kuo, Hsinchu, TW;

Chien-Nan Yeh, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 23/00 (2006.01); H10H 20/01 (2025.01); H10H 20/851 (2025.01); H10H 20/852 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 24/20 (2013.01); H01L 24/95 (2013.01); H10H 20/852 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01); H01L 24/19 (2013.01); H01L 2224/19 (2013.01); H01L 2224/215 (2013.01); H01L 2224/95001 (2013.01); H10H 20/0362 (2025.01); H10H 20/0363 (2025.01); H10H 20/0364 (2025.01); H10H 20/8515 (2025.01);
Abstract

A pixel package is provided. The pixel package includes a flexible redistribution layer and a plurality of LED chips arranged on the surface of the flexible redistribution layer in a flip-chip manner. The pixel package also includes a plurality of light-adjusting layers respectively disposed on the LED chips. The pixel package further includes a plurality of flexible composite laminates disposed on the surface of the flexible redistribution layer and between the LED chips.


Find Patent Forward Citations

Loading…