The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Jun. 13, 2022
Applicant:

Seoul Semiconductor Co., Ltd., Gyeonggi-do, KR;

Inventors:

Woo Gun Lee, Gyeonggi-do, KR;

Young Il Go, Gyeonggi-do, KR;

Youngsik Ki, Gyeonggi-do, KR;

Seung Sik Hong, Gyeonggi-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/13 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H10H 20/853 (2025.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H01L 25/13 (2013.01); H01L 25/167 (2013.01); H10H 20/853 (2025.01); H01L 24/05 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/98 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/27602 (2013.01); H01L 2224/29006 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29316 (2013.01); H01L 2224/29318 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/83224 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/98 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/12041 (2013.01); H10H 20/034 (2025.01); H10H 20/0362 (2025.01);
Abstract

A method of repairing a display panel and a repaired display panel are provided. The display panel includes a panel substrate, a plurality of micro LEDs arranged on the panel substrate, and a molding member covering the plurality of micro LEDs. The molding member includes a first molding member and a second molding member disposed in a region surrounded by the first molding member. The second molding member has a composition or a shape different from that of the first molding member, and the second molding member surrounds at least one side surface of the plurality of micro LEDs.


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