The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Mar. 25, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jinduck Park, Asan-si, KR;
Chansik Kwon, Asan-si, KR;
Yongseong Kim, Asan-si, KR;
Inwook Im, Cheonan-si, KR;
Jiyeon Han, Asan-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
A semiconductor chip includes a semiconductor substrate including a device region, and an edge region surrounding the device region, a device layer on the semiconductor substrate, a wiring layer on the device layer, a side surface of the wiring layer at least partially defining a recessed region that is in the edge region such that the side surface of the wiring layer is exposed by the recessed region, and an upper insulating layer on the wiring layer. The recessed region extends from a side surface of the device layer toward the device region. A first portion of the upper insulating layer covers the side surface of the wiring layer that is exposed by the recessed region.