The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
May. 19, 2023
Applicant:
Temnest Inc., Hwaseong-si, KR;
Inventors:
Assignee:
TEMNEST INC., Hwaseong-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01T 23/00 (2006.01); C04B 35/575 (2006.01); C04B 35/645 (2006.01); C04B 37/00 (2006.01); C04B 37/02 (2006.01); C22C 29/06 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); C04B 35/575 (2013.01); C04B 35/645 (2013.01); C04B 37/008 (2013.01); C04B 37/028 (2013.01); C22C 29/065 (2013.01); C04B 2235/3891 (2013.01); C04B 2235/402 (2013.01); C04B 2235/656 (2013.01); C04B 2237/365 (2013.01); C04B 2237/402 (2013.01);
Abstract
The present disclosure relates to an electrostatic chuck and a method of manufacturing the same. A problem in that the yield of a wafer is reduced due to a partial destruction phenomenon attributable to thermal expansion of an electrostatic chuck is solved and the lifespan of a wafer is increased by making a coefficient of thermal expansion of a lower plate of an electrostatic chuck similar to a coefficient of thermal expansion of an upper plate of the electrostatic chuck.
Kim, Hae. (2025). Electrostatic chuck and method of manufacturing the same (U.S. Patent No. 12431380). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12431380
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile