The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Aug. 24, 2022
Applicant:

Beijing Naura Microelectronics Equipment Co., Ltd., Beijing, CN;

Inventor:

Jiajia Chai, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 16/25 (2019.01);
U.S. Cl.
CPC ...
G06F 16/258 (2019.01);
Abstract

The present disclosure provides a data collection method, a data collection device, and a data collection system of the semiconductor processing equipment. The method includes receiving an activated data collection plan via the first communication interface, determining equipment data information to be collected in the data collection plan, sending the equipment data information to the semiconductor processing equipment via the second communication interface, and receiving equipment data corresponding to the equipment data information sent by the semiconductor processing equipment and forwarding the equipment data to the equipment control system via the first communication interface to display the equipment data.


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Chai, Jiajia. (2025). Data collection method, device, and system of semiconductor processing equipment (U.S. Patent No. 12430354). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12430354

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