The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Mar. 25, 2022
Applicant:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Inventors:

Jerry Anton Ahrens, Sister Bay, WI (US);

William Robert Alverson, Del Valle, TX (US);

Amitabh Mehra, Fort Collins, CO (US);

Grant Evan Ley, Eden, UT (US);

Anil Harwani, Austin, TX (US);

Joshua Taylor Knight, Georgetown, TX (US);

Assignee:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/206 (2013.01);
Abstract

Package lids with carveouts configured to expose lights directly connected to an internal component of a processor are described. Lid carveouts are configured to precisely align and mechanically secure a cooling device to the package lid by receiving protrusions of the cooling device via a press fit connection, while maintaining visibility of lights directly connected to processor internal components when the cooling device is connected. Lid carveouts are further configured to expose one or more connectors disposed on a processor surface that supports its internal component. When contacted by corresponding connectors of an auxiliary device, such as a light not integrated into a processor package or a cooling device, the lid carveouts enable direct connections between the package's internal components and the auxiliary device.


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