The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Mar. 08, 2023
Applicants:

Dic Corporation, Tokyo, JP;

Meiji University, Tokyo, JP;

Inventors:

Kazutoshi Terauchi, Sakura, JP;

Toshinori Yamaji, Sakura, JP;

Hiromasa Kaneko, Kawasaki, JP;

Shuto Yamakage, Kawasaki, JP;

Assignees:

DIC CORPORATION, Tokyo, JP;

MEIJI UNIVERSITY, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 3/44 (2006.01); G01N 21/65 (2006.01);
U.S. Cl.
CPC ...
G01J 3/4412 (2013.01); G01N 21/65 (2013.01);
Abstract

To calculate the properties of a resin composition in a short time and with high accuracy, a resin property value prediction apparatus includes an acquisition unit acquiring spectral data obtained by measuring a resin composition by a spectroscopic sensor in a process of performing a resin polymerization reaction in a batch type reaction tank and a calculation unit, using a learned model learned with spectral data obtained by measuring the resin composition in advance and a resin property value as training data, calculating the resin property value of the resin composition having the spectral data acquired by the acquisition unit.


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