The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Jul. 25, 2023
Applicant:

Merry Electronics(shenzhen) Co., Ltd., ShenZhen, CN;

Inventors:

Po Kai Chang, Taichung, TW;

Yung-Hsiang Chang, Taichung, TW;

Jia Yin Wu, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 5/02 (2006.01); G01D 11/24 (2006.01);
U.S. Cl.
CPC ...
G01D 5/02 (2013.01); G01D 11/245 (2013.01);
Abstract

An electronic device, including a substrate, a package component, a first sensor chip, and a second sensor chip, is provided. The substrate has an inner space and a first through hole communicated with the inner space. The package component is disposed on the substrate and forms a front chamber and a back chamber together with the substrate. The package component has an opening. The front chamber is communicated with an outside air by the opening. The inner space constitutes at least part of the back chamber, and the back chamber is communicated with the front chamber by the first through hole. The first sensor chip is disposed on the substrate and covers the first through hole to separate an airflow in the front chamber and an airflow in the back chamber. The second sensor chip is disposed on the substrate and located in the back chamber.


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